| 摘要 |
<p>PURPOSE:To simplify a titled circuit and to improve the reliability, by forming a dielectric base to be overlapped with an inner conductor for a specified section and connecting the overlapped inner conductors with a conductive adhesive layer. CONSTITUTION:Terminals 4a, 4b are formed to a triplate line constituted through the superimposition of outer conductors 2a, 2b, dielectric bases 1a, 1b and an inner conductor 3 so as to vertically be formd on a coating surface of the outer conductors 2a, 2b, and the inner conductor 3 is coated to the two dielectric based 1a, 1b with split so as to directly be connected to the terminals 4a, 4b with the chemical processing technology. Thus, the inner conductor 3 coated on the two dielectric bases 1a, 1b is formed to be overlapped for a specified section. The surface of the overlapped conductors 3 is connected via a conductive adhesive layer 5, allowing to attain high reliability and simple manufacture. Holes not overlapped to one or both inner conductors are formed and excessive conductive adhesive layer can be prevented from being leaked externally.</p> |
