发明名称 MOUNTING DEVICE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To prevent bubbles from being discharged along with a bonding agent to be discharged by the deaerating action of ultrasonic wave by a method wherein a means to give ultrasonic vibrations to a cylindrical container to house the bonding agent, which is a material to be discharged, is adopted. CONSTITUTION:One end of a cylindrical container 1 is provided with a discharge hole 2 with a small diameter and the other end is provided with a pressure transfer hole 4 for transferring pressure to press a bonding agent 3 to be injected with air pressure. At that time, the container is annexed with an ultrasonic vibration part 6 connected with an ultrasonic generator 5. Whereupon, bubbles being included in an epoxy silver paste rises to the upper part of the cylindrical part and disappear or cease to exist in the vicinity of the discharge hole 2. Accordingly, the inclusion of the bubbles in the bonding agent to be discharged is almost eliminated.
申请公布号 JPS6295836(A) 申请公布日期 1987.05.02
申请号 JP19850235336 申请日期 1985.10.23
申请人 TOSHIBA CORP 发明人 ARAKI KOJI
分类号 H01L21/52;H01L21/58 主分类号 H01L21/52
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