| 摘要 |
PURPOSE:To facilitate high speed switching operation of a resin sealed semiconductor integrated circuit by providing a substance whose dielectric constant is lower than that of the sealing resin between internal leads and an integrated circuit chip or between the leads and a die pad or a heat sink on which the chip is mounted. CONSTITUTION:A resin sealed semiconductor integrated circuit is constituted by an IC chip 1, resin 2, leads 3, a die pad 4, fine metal wires 5 and a low dielectric constant member 7 which has a lower dielectric constant that the resin 2 and is provided between the lens 3 and the IC chip 1 or a heat sink 6. As the low dielectric constant member 7 is provided, high speed switching operation of the IC 1 can be realized. |
