发明名称 PREPARATION OF FLOORING MATERIAL WITH CHIP-SHAPED PATTERN
摘要 PURPOSE:To prepare continuously a flooring material on the surface of which chip-shaped patterns are thinly scattered by putting large chips arranged with spacings on a layer of a synthetic resin powder or pellet continuously moved on a moving plate and by sintering and hot-pressing them thereafter. CONSTITUTION:Pellets supplied on a moving plate 1 become a pellet layer P of a homogeneous thickness by means of a leveling plate 4. Chips C fallen from a hopper 5 fall on a vibrating plate 7 through a gate 6 which intermittently opens and closes and are supplied on the pellet layer P after moved on this vibrating plate 7 while being vibrated. The chips C are scattered with about the same spaces over the whole length of the pellet layer P. In a sintering furnace 8, the surface layer of the pellet layer P melts to become a belt-shaped base layer 9, where the central part of the pellets, i.e. unmolten parts as they were are densely scattered. The gaps left between pellets are filled by means of a hot press and the surface of the base layer 9 is smoothened and the chips C are buried in the base layer 9.
申请公布号 JPS6294313(A) 申请公布日期 1987.04.30
申请号 JP19850234309 申请日期 1985.10.19
申请人 TAKIRON CO LTD 发明人 SATOMI AKINOBU;BUTSUTA TAKASHI
分类号 B29C39/16;B29C39/20;B29C39/22;B29K105/16;B29L31/10 主分类号 B29C39/16
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