| 摘要 |
PURPOSE:To increase the mechanical strength of a sealing section by placing a circuit substrate onto a film with a fine hole, giving heat resistance and release properties, filling a hole in the circuit substrate on the film with a synthetic resin and peeling the film from the circuit substrate. CONSTITUTION:A semiconductor chip 1 bonded under a hung state by metallic small-gate wires 3 in a hole in a circuit substrate 2 is prepared previously. On the other hand, a lower base 4 is heated, and a film 8 is annexed onto the lower base 4. The film 8 is a Teflon film abounnding in heat resistance and release properties, and fine holes are formed to the film. The circuit substrate 2 is placed on the film 8, and a sealing frame 9 is applied and the upper surface and peripheral section of the chip are coated with an epoxy resin. The resin is cured, and the film 8 is peeled from the substrate 2.
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