| 摘要 |
PURPOSE:To improve the damp-proofing of a semiconductor device by using a water non-permeable material as a sealing-resin running prevention frame and stopping an intrusion of moisture to a cavity section in an electric insulating substrate. CONSTITUTION:A frame 10 consisting of a water non-permeable material is mounted around a section coated with a thermo-setting resin 9. A water non- permeable material and a material forming no clearance from the difference of thermal expansion coefficients between the frame 10 and a resin 11 for attaching the frame, such as a material coating the surface of a metal with the resin or a material enamelling the surface of the metal may be employed as the frame 10. Consequently, an intrusion to a cavity section in an electric insulating substrate of moisture is prevented. Accordingly, the damp-proofing of a semiconductor device is improved. |
