发明名称 MANUFACTURE OF CONDUCTIVE FILM
摘要 PURPOSE:To reduce the number of steps and to increase the bonding strength of a plated film by containing at least one type of metal content having catalytic function such as Pd on a transparent conductive film made of metal oxide to electrolessly plate it. CONSTITUTION:When forming a transparent conductive film containing metal oxide as one content on a substrate 1 of glass substrate, the film is formed to contain at least one of the 8 group metals of Fe, Co, Ni, Ru, Rn, Pd, Os, Ir, Pt and Cu, Ag, Au, Be, Ge, Al, C, V, Mo, Cr, Se, Ti, U. When the film is patterned by photoetching, the film 2 of a predetermined pattern given by catalytic function is formed. Then, catalytic nucleus presented on the surface of the film 2 is activated by an activating agent to further improve the bondability to the electrolessly plated film of next step. Then, the electrolessly plated film 3 is covered by electrolessly plating.
申请公布号 JPS6290982(A) 申请公布日期 1987.04.25
申请号 JP19850229944 申请日期 1985.10.17
申请人 ISE ELECTRONICS CORP 发明人 MORIKAWA MITSUAKI
分类号 H01B5/14;G02F1/1343;H01L31/0224;H01L31/04;H05K3/24 主分类号 H01B5/14
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