| 摘要 |
PURPOSE:To simplify the steps by covering only the aluminum electrodes of a semiconductor element with a non-oxidative material, and connecting the material with the electrodes of a circuit substrate via a conductive adhesive to remarkably reduce a high contacting resistance between the aluminum electrode and the adhesive. CONSTITUTION:Non-oxidative metal layer 3 of Au, Pt, Pd is formed on aluminum electrodes 2 of a semiconductor element 1. A circuit substrate 4 corresponds to the electrodes 2 on a ceramic- or glass-filled epoxy substrate 5, and conductor wirings 6 for connecting with an external circuit are formed. The electrodes 2 and the wirings 6 are connected via a conductive adhesive 7. The adhesive 7 may be any of thermo or photocurable resin or thermoplastic resin. The resin itself may have conductivity, or fine metal powder of Ni and C, Ag, Au or solder may be dispersed in the resin. The adhesive 7 is mounted in advance on any of the element 1 or the substrate 4. The way of mounting may employ a screen printing method or a punching method from a nozzle. |
