METHOD FOR PRODUCING HYBRID INTEGRATED CIRCUIT

摘要

A method for producing a hybrid integrated circuit includes steps of: applying an adhesive to an electronic part mounting conductor on an insulating substrate; adhering an electronic part to the applied adhesive and hardening the adhesive to temporarily fix the electronic part; fixing the temporarily fixed electronic part on the conductor with solder; and dissolving the hardened adhesive in a solvent and removing it. Upon being hardened, the adhesive can withstand the heat of molten solder and can be dissolved in a solvent and removed therewith.