| 摘要 |
PURPOSE:To prevent oozing of resin externally of a frame in a lead frame of a resin molded semiconductor device by forming a cutout of lead terminal shape on the entire external surface of the resin coated seal of the lead frame. CONSTITUTION:The lead terminal 5 of the shape continued to the respective lead terminal 3 is formed via cutout on the entire external surface of the resin seal 4 of a lead frame 1 formed with a semiconductor element carrying portion 2 and a lead terminal 3. A semiconductor chip is carried on the carrying portion 2, and wire bonded to the respective lead terminals 3. It is clamped with upper and lower molding dies, resin is filled in the resin seal 4 to mold it. The unnecessary lead frame forming metallic member around the outside lead terminal 5 outside the resin seal 4 is cut off along the cutout. |
