| 摘要 |
PURPOSE:To obtain a high strength Cu alloy having high electric conductivity for a lead material for a semiconductor apparatus or an electrically conductive spring material by adding specified amounts of Sn, P and Mn to Cu. CONSTITUTION:The composition of a CU alloy is composed of, by weight, 0.8-2% Sn, 0.005-0.08% P, 0.05- 0.2% Mn and the balance Cu with inevitable impurities. The composition may further contain 0.05-1% Ni, or 0.05-1% one or more among Al, Be, Co,Cr, Fe, Hf, In, Mo, Mg, Pb, Si, Te, Ti, Zn, and Zr. |
