| 摘要 |
<p>A vapor phase bonding apparatus wherein articles to be bonded are heated with hot vapors of a heat transfer liquid so that a bonding agent such as a solder provided between the articles to be bonded is melted to effect the bonding. The appratus includes a vessel for containing the heat transfer liquid, a heater for vaporizing the heat transfer liquid, inlet and outlet port means provided in the vessel to allow the passage of articles to be bonded therethrough, conveying menas to convey the articles through the inside of the vessel via inlet and outlet port means, closure means for opening and closing the inlet and outlet port means, and cooling means provided in the closure means for condensing vapors of the heat transfer liquid </p> |
