| 摘要 |
<p>PURPOSE:To obtain an epoxy resin compsn. for photocoupler having high reliability and light transmissivity by specifying a content of metal in the resin compsn. comprising epoxy resin and a curing agent basing on the content of molten silica powder. CONSTITUTION:The content of metal in a resin compsn. contg. 30-70pts.wt. epoxy resin and a curing agent basing on 100pts.wt. molten silica powder is characterised to be <=50ppm. The reason why the content of epoxy resin and the curing agent is regulated to 30-70pts.wt. per 100pts.wt. molten silica is that the light transmissivity is deteriorated due to increase of scattering of light by the molten silica powder if the content is <=30pts.wt.; and that delamination would be caused at the interface of the molten silica powder and the external resin resulting inferiority in reliability if the content is >=70pts.wt. Further, the reason why the content of metal is regulated to <=50ppm is that the light transmissivity would be deteriorated due to increase of light absorption by the metal if the content of metal is >=50ppm.</p> |
