Dual electron injection structure and process with self-limiting oxidation barrier

摘要

A dual electron injection structure (DEIS) and process for incorporating it into a semi-conductor structure, such as an E2PROM and/or NVRAM, is disclosed. The DEIS includes a composite structure formed from a layer of silicon rich nitride, a layer of silicon dioxide (SiO2) and a layer of silicon rich oxide. Preferably, a Plasma Enhanced Chemical Vapor Deposit (PECVD) method or a low pressure chemical vapor deposit (LPCVD) method is used to place the DEIS between the Poly 1 and Poly 2 devices of the semi-conductor structure.