发明名称 Automated single slice powered load lock plasma reactor
摘要 A plasma reactor for the manufacturing of semiconductor devices has powered loadlocks and a main process chamber where slices can be processed one slice at a time with pre-etch plasma treatments before the main etching processing and afterwards receive a post etch treatment. The system comprises powered loadlocks, a main chamber, vacuum pumps radio frequency power supplier, radio frequency matching networks, heat exchangers and throttle valve and pressure controllers, gas flow distribution and microprocessor controllers. The semiconductor wafers are automatically fed one at a time from storage cassettes through isolation gates with articulated mechanical arms to a powered entry loadlock for pre-etching processes. At the completion of the pre-etching processing, the semiconductor wafer is transferred to the main chamber automatically for the main etch process and then to the powered exit loadlock for post etch treatment and finally to an output cassette.
申请公布号 US4657620(A) 申请公布日期 1987.04.14
申请号 US19840663905 申请日期 1984.10.22
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 DAVIS, CECIL J.;SPENCER, JOHN E.;HOCKERSMITH, DAN T.;HILDENBRAND, RANDALL C.;BROWN, FREDERICK W.;KOHAN, STANFORD P.
分类号 H01L21/302;H01J37/32;H01L21/3065;(IPC1-7):H01L21/306;B44C1/22;C03C15/00;C23F1/02 主分类号 H01L21/302
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