发明名称 RESIN SEALING DEVICE
摘要 PURPOSE:To prevent the outflow of resin on a lead frame by a method wherein a pressure-equalizing block, in which a plurality of elastic bodies are built in, is provided between the platen and the metal molds of a pressing device. CONSTITUTION:A plurality of elastic bodies 11, 11... such as springs, which can resist the clamping pressure of pressing molds, are provided between the upper platen 9 and the top force 7 of a pressing device. Said elastic bodies 11 are supported by a pressure-equalizing block 12. As a result, even when the platen 9 of the pressing device is bent, uniform press mold clamping pressure acts on the chase block 1, because the pressure-equalizing block 12 equipped with the built-in elastic bodies 11 is provided between the chase blocks 1, and a uniform plane surface can be maintained without generating a gap on the parting surface 10 located between the top force 7 and the bottom force 6. Consequently, the outflow of resin can be prevented, and the removing work of the flowed out resin to be performed after a sealing process can be unnecessitated; besides, the highly precise resin sealing device producing no distortion of metal molds can be obtained.
申请公布号 JPS6279631(A) 申请公布日期 1987.04.13
申请号 JP19850220649 申请日期 1985.10.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 TANAKA SUEKICHI
分类号 H01L21/56;B29C43/32;B29C45/02;B29C45/14;B29C45/17;B29C45/64;B29K101/10;B29L31/34 主分类号 H01L21/56
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