发明名称 BONDING DEVICE
摘要 PURPOSE:To easily cope with the variation in dimensions of the bond area, by forming a means for holding and transferring a plurality of adhesive pieces having a shape corresponding to the bond area of an adherend so that the distance from the center thereof can be enlarged. CONSTITUTION:When a tapered pin 26 is driven downward, each adsorption portion 21 is slid outward against the elastic force of a coiled spring 29 which has been fit into grooves 21g. This serves to enlarge the distance from a central axis A of a vacuum chuck 20 to each of the adsorption ports 22a and 22b (adsorption radius). On the other hand, when the tapered pin 26 is driven upward, each adsorption portion 21 is slid inward through the elastic force of the coiled spring 29, thereby shortening the adsorption radius. The adsorption radius can be adjusted according to the variation in the radius of the bond area of adherends from lot to lot, by regulating the extent of descent of the tapered pin 26 by means of the adjusting screw 28.
申请公布号 JPS6274979(A) 申请公布日期 1987.04.06
申请号 JP19850216762 申请日期 1985.09.30
申请人 SONY CHEM KK 发明人 NOGUCHI ISAO;TAKAYASU MITSUYUKI;KISHINO YOSHIYUKI
分类号 C09J5/00;B29C65/52;B29C65/78;B65C9/18 主分类号 C09J5/00
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