| 摘要 |
A method for joining nickel and nickel base alloys comprising disposing a thin film of a metal selected from a class consisting of titanium and niobium (or columbium) between the surfaces to be joined, pressing the surfaces together whereby the film forms an intermediate layer, heating to a eutectic temperature and holding the surfaces at such temperature for a period of time to allow sufficient diffusion of the nickel into the intermediate layer, the formation of a liquid in the intermediate layer and a return to a solid state diffusion between intermediate layer and nickel.
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