| 摘要 |
PURPOSE:To obtain the title molding compound chips free from sticking among themselves, by dry-blending of a specific metal salt of organic acid in a low molecular weight polyolefin and then drying the mixture. CONSTITUTION:Preferably 0.05-2 wt.% of a metal salt of organic acid such as sodium stearate is added to a copolyester composed of, as an acid component, terephthalic acid, etc. and, as a glycol component, ethylene glycol, etc. Furthermore, 0.05-5 wt.% of a low molecular weight polyolefin such as polyethylene having a molecular weight of pref. 1,000-5,000 is added. The resulting composition is then subjected to dry-blending by a blender and dried in hot air at pref. 100-260 deg.C, thus obtaining the objective molding compound. |
