| 摘要 |
A fluid cooled semiconductor socket comprising a thermally conductive plate adapted to hold the semiconductor in good thermal contact with the plate at a point of the semiconductor case having a hgh thermal conductivity with the semiconductor chip inside the case. A thermally conductive fluid conduit is attached to the plate on a face directly opposite from the semiconductor. The conduit is placed so as to maximize the thermal conductivity between the point where it is placed on the plate and the semiconductor chip, but still allow the electrical leads from the semiconductor to pass through the plate and establish electrical contact on the other side without obstruction by the fluid conduit. The fluid flowing through the conduit is made to absorb and conduct away increased amounts of heat by narrowing the conduit where it is in contact with the plate so as to increase the fluid velocity and reduce the slow moving fluid boundary layer in contact with an inner wall of the conduit, and by promoting turbulence in the field flow through ths narrowed portion. The plate and conduit are imbedded in a plastic housing which is keyed to lock into a multi-socket strip which orientates the conduit ends for mating with electrical leads and with manifolds conveying the cooling fluid.
|
