Apparatus for polishing semiconductor wafers.

摘要

An apparatus for polishing semiconductor material having a movable polishing arm 10 which is mounted to a cabinet 17. Connected to the polishing arm 10 is a workpiece holder sometimes referred to as a wafer chuck 11. Adjacent to the polishing arm 10 is a load station 12 which positions the wafer for pick-up by the polishing arm 10 and attached wafer chuck 11. Mounted to the cabinet 17, next to a brush station 13, is a primary polish station 14 which is used to remove the majority of the material. Alongside of the primary polish station is a final polish station 15 used to provide a finished surface to the wafer. The polishing arm 10 discharges the polished wafer into an unload station 16 located next to the final polish station 15.