| 摘要 |
PURPOSE:To prevent the formation of a solder bridge or a solder ball and thereby to improve the reliability of connection when the connection is made with a base substrate, by providing a dummy pad for attracting solder between pads for connection. CONSTITUTION:A dummy pad 9 for attracting solder is provided between pads 2 for connection with a base substrate. The dummy pad 9 is formed of a material, such as a metal, which is similar to the one of the pad 2 for connection and attracts the solder which contracts and hardens. The solder which protrudes or scatters from the pads 2 for connection of this leadless chip carrier when the pads 2 are soldered to a circuit on the base substrate by reflow soldering or the like is melted when heated, and is attracted to the dummy pad 9. Thereby the formation of a solder bridge or a solder ball is prevented, and thus the reliability of connection is improved. |
