| 摘要 |
PURPOSE:To enable an inspection by X-ray after sealing or enclosing operation in an air-tight package for use in storing a semiconductor element by a method wherein an opening having decayed electric conductive layer is made in a part of the electric conductive layer in a ceramic member forming the package. CONSTITUTION:Ceramic bottom plate 1 and the ceramic side wall member 2 are integrally formed with burning and a metalized layer 4 for use in connecting a flat bar member 3 is arranged on it. On the rear surface of the bottom member 1 are fixed terminal members 9 and 10 in a direction of XY' through the metalized layer. Ground terminal members 5 and 7 are fixed through the metalized layer in a direction of XX'. End part is bent at the outer surface of the side wall member 2 and projected inwardly to form the connected conductive layer 17 and then the layer is connected to the semiconductor element 13 through wire 14. With this arrangement, opening 18 having decayed layer 17 in one of the connected conductive layer 17, resulting in enabling a trasparency of the X-ray toward the side wall member 2. |
