| 摘要 |
To avoid destruction of semiconductor chips (1), particularly those using MOS technology, as a result of electrostatic discharge, a commercial adhesive (e.g. silicone, epoxy or acrylic adhesive) contains an admixture of electrically conductive material such as soot and/or graphite. This provides high-resistance interconnection of all the terminals of the semiconductor chip (1). <IMAGE> |
