| 摘要 |
<p>A method of providing an electrical circuit on a surface of a three-dimensionally shaped substrate of insulating plastics material comprising providing a carrier film (33) of insulating plastics material with a circuit pattern (31) of electro-conductive or electro-resistive, heat-resistant synthetic resin applied to at least one face (32); supporting a face of the carrier; forming a carrier into a given three-dimensional shape; and, moulding, by the application of heat and pressure in a mould cavity (38), a substrate (34) of insulating plastics material against the unsupported face of the carrier; so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.</p> |
