BONDING LEADS TO SEMICONDUCTOR DEVICES

摘要

In the bumped-tape automated bonding process for connecting leads to a semi-conductor circuit device, it is known to form the bumps on the free ends of the conductive leads of the tape by plating or etching. In the present invention, the free ends of the leads on the tape are heated by means of a laser beam to melt the ends of the leads so that surface tension forces form the liquid-phase end of each lead into a ball, constituting the bonding bump. The bumped ends of the leads of the tape are then bonded to terminals of the semiconductor device by conventional means.