| 摘要 |
PURPOSE:The titled composition, obtained by incorporating a specified curing accelerator with a spiroorthocarbonate compound and phenolic resin, having improved dimensional accuracy in molding without volume shrinkage in curing and curable in a short time at low temperatures. CONSTITUTION:A thermosetting resin composition obtained by incorporating (A) a spiroorthocarbonate group-containing compound expressed by formula I (R<1> and R<2> are bifunctional organic group) with (B) a phenolic resin and (C) a curing accelerator selected from (i) acetylacetone complex salt based curing accelerators consisting of (trifluoro)acetylacetone complex salt or hexafluoroacetylacetone complex salts, (ii) sulfuric acid ester based curing accelerators consisting of a compound expressed by formula II or III (R<3> and R<4> are alkyl), (iii) Leiws acid based curing accelerators consisting of salts containing anions selected from BF<d4->, PF6<->, AsF6<-> and SbF6<-> or (iv) organotin compound based curing accelerators consisting of aliphatic or aromatic tin compounds containing bi- or tetravalent Sn. |
