| 摘要 |
PURPOSE:To reduce the warpage and the distortion of a package when resin is molded by a method wherein a slit is provided on the part where the lead of the frame body of a lead frame is coupled, and the position of the slit is set toward the inside of the center point of the frame body. CONSTITUTION:A slit 8 is provided on a frame body 7 having a plurality of leads arranged on a tab 2 to be used for connection of a semiconductor pellet and the circumference of the tab, and a slit 6 having the width (a) of tab lead side smaller than the width (b) of the side separated from the tab lead, is provided on both side faces 5. The slit 8 provided on the frame body part 7 of the lead frame absorbs the distortion generated in the longitudinal direction of the lead frame, and the warpage in longitudinal direction of the entire lead frame can be prevented by the contractile force of resin. Also, the slits 6 provided on both side faces 5 absorb the distortion generated in the width direction of the lead frame, and as a result, the generation of the warpage on the package can be prevented. |
