| 发明名称 |
METHOD AND APPARATUS FOR TAPE AUTOMATED BONDING OF INTEGRATED CIRCUITS |
| 摘要 |
<p>METHOD AND APPARATUS FOR TAPE AUTOMATED BONDING OF INTEGRATED CIRCUITS A method and apparatus are presented for tape automated bonding of integrated circuits wherein a support ring is formed in the feature window to provide reinforcement for unsupported interconnection leads between the inner and outer lead bond sites.</p> |
| 申请公布号 |
CA1218761(A) |
申请公布日期 |
1987.03.03 |
| 申请号 |
CA19840470999 |
申请日期 |
1984.12.24 |
| 申请人 |
ROGERS CORPORATION |
发明人 |
MAXWELL, MICHAEL J. |
| 分类号 |
H01L21/60;H01L23/495;(IPC1-7):H01L21/48;H01L23/48 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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