| 摘要 |
PURPOSE:To reduce the size of a facility adapted for multikind small quantity production by interposing a semiconductor device or the like between upper and lower shells, evacuating by a vacuum molding machine, and heating while supplying nitrogen gas. CONSTITUTION:Thermosetting resin such as epoxy resin is compressed to manufacture a tablet 1, and upper and lower shell equivalents are weighed while preheating at 70-80 deg.C. The thus obtained upper and lower shell materials 2, 3 are preheated by a high frequency preheater to be molded in shell shape by a compression molding method, and thermosetting resin and adhesive are coated on the bonding surfaces of the upper and lower shells 4, 5. Then, electronic parts such as a semiconductor device which is finished in assembling on a lead frame 7 are interposed between one set of upper and lower shells 4, 5, and temporarily molded. Then, it is heated in a vacuum molding machine. In this case, nitrogen gas is fed while evacuating in vacuum to prevent the metal portion from oxidizing. Thereafter, it is annealed. |
