发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:The titled composition excellent in heat shock resistance, comprising an epoxy resin, a novolak phenolic resin, a phenolaralkyl resin and a specified styrene copolymer. CONSTITUTION:100pts.wt. epoxy resin (A) having at least two epoxy groups in the molecule and having a softening point of 60-100 deg.C and an epoxy equivalent weight of 100-300, which may contain 30wt% or below flame-retarding epoxy resin, is mixed with 50-90pts.wt. total of 10-50pts.wt. novolak phenolic resin of a softening point of 60-120 deg.C and a hydroxyl equivalent of 100-150 and 10-50pts.wt. phenolaralkyl resin (B) of a softening point of 80-120 deg.C and a hydroxyl equivalent of 195-235 and 2-40pts.wt. carboxyl group- containing styrene copolymer (C) (e.g., styrene/maleic acid copolymer) and this mixture is melted and kneaded.</p>
申请公布号 JPS6245615(A) 申请公布日期 1987.02.27
申请号 JP19850184312 申请日期 1985.08.23
申请人 TOSHIBA CORP 发明人 YOSHIZUMI AKIRA;MATSUMOTO KAZUTAKA;UCHIDA TAKESHI;AZUMA MICHIYA
分类号 C08G59/00;C08G59/62;C08L33/00;C08L33/02;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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