Appliance for high-capacity cathode sputtering

摘要

In an appliance for high-capacity cathode sputtering there are arranged in a process chamber (1) a target (3), a magnetron (4) and a substrate (2) to be sputter-coated. The process chamber (1) is evacuated via the valve (V1) by a turbomolecular drag pump (T) and a forepump (V) connected upstream thereof. The process gas is fed in via a valve (V2) of a process-gas infeed (5), the process-gas infeed (5) being arranged in the immediate vicinity of the target (3) parallel to the target edge. Target (3) and process-gas infeed (5) are positioned below a screen system (7) which forms a discharge chamber (6) closed off against the process chamber (1). <IMAGE>