| 摘要 |
<p>A soldering apparatus including a first vessel through which printed circuit boards are transferred for soldering by a combination of a solder wave and hot vapors of a heat transfer liquid, a second vessel in which heat transfer liquid is heated and vaporized, a gas feed conduit extending between the first and second vessels and having a pump for feeding the vapors produced in the second vessel to the first vessel, and a liquid recycling conduit extending between the first and second vessels and having a pump for recycling heat transfer liquid formed by the condensation of the vapors and collected in the first vessel to the second vessel.</p> |
