| 摘要 |
<p>In a method for joining two surfaces by employing a fabric preform an adhesive is applied to one surface, a fabric preform affixed thereto, said surface is joined to the other surface and the resultant assembly clamped together under a temperature and for a time sufficient to effect airing. The present invention is particularly useful in the microelectronics industry, for example to join a microelectronic substrate bearing electronic circuitry to a ceramic or metal package while avoiding problems with runout and voiding.</p> |
