| 摘要 |
PURPOSE:To improve high frequency characteristics, by using a circular or elliptical package, in which five or more terminals are arranged in a radial pattern. CONSTITUTION:A lead 5 is provided between a terminal 1 and a terminal 2. A lead 6 is provided between a terminal 3 and a terminal 4. In this package, the length from a chip fixing part 31 to terminals 32-36, which are to be wire- bonded, becomes almost equal to the length from the end of a plastic sealing part to the end of the lead. The length becomes considerably small, as 1-1.5mm. Therefore, high frequency characteristics can be improved. |
