发明名称 IC PACKAGE
摘要 PURPOSE:To keep a chip against static breakdown when an IC is carried and mounted, by equipping a package with a switch capable of shorting all leads or pins of the package. CONSTITUTION:A second-layered metal wiring 7, which shorts all PINs of a package 3 at their roots, is used for shorting all IC pins when the IC being carried and mounted on a device. Pressing a switch 8 enables the second-layered metal wiring 7 shorting PINs to come in contact with PINs 6 and short all the pins. Hence, with all the pins shorted, pin-capacity is extremely increased to suppress the transient response and reduce the peak voltage remarkably, and therefore the IC can be kept from static electricity.
申请公布号 JPS6235653(A) 申请公布日期 1987.02.16
申请号 JP19850175201 申请日期 1985.08.09
申请人 NEC CORP 发明人 EBINA MASAKI
分类号 H01L23/00;H01L23/50;H01L23/60 主分类号 H01L23/00
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