| 摘要 |
PURPOSE:To load a semiconductor laser chip easily with high accuracy by forming a recessed section to the end surface of a stem mounting section. CONSTITUTION:A stem mounting section 4 has a recessed section 43 where a semiconductor laser chip must be loaded, and width L in the X direction and depth length D in the Z direction of the recessed section 43 are each made smaller than the width and depth length of the semiconductor laser chip. The semiconductor laser chip is loaded on the surface of the stem mounting section 4 so that the end surface of the semiconductor laser chip coincides with the end surface 42 of the stem mounting section 4. In this case, the semiconductor laser chip does not fall into the recessed section 43, and laser projecting beams are not reflected by the surface 41. Consequently, high accuracy is realized because the recessed section 43 is used as a reference regarding displacement in the X direction according to the stem, and accuracy in the Z direction and the theta direction can also be improved very easily because work in which the end surface of the chip and the end surface 42 are conformed with each other may be executed. |
