| 摘要 |
<p>PURPOSE:To improve pasting effect and work efficiency by a method wherein a wafer suppressing board is arranged on the surface of a carrier jig and a defoaming roller is provided, on the rear side of a carrier tape, rotatingly travelling along the carrier jig. CONSTITUTION:When a carrier jig 10 approaches a defoaming and tape-peeling section 5, a suppressing board 18 comes down to depress a wafer 12 and a defoaming roller 21 travels rotatingly along the rear side of the carrier jig 10, for the removal of air foam between a carrier tape 11 and supporting tape 13 for the wafer 12. In a process to follow, the suppressing roller 19 comes down, the peel tape 20 is pressed against a protecting tape 14 located on the upper surface of the wafer 12, the peel tape 20 goes up, as the result of which the protecting tape 14 is pasted to the peel tape 20 and peeled off the surface of the wafer 12. Together with the peel tape 20, the protecting tape 14 is caused to move, due to the rotation of the suppressing roller 19, to be taken up by a roller. A next peel tape surface comes in. This process improves pasting effect and production efficiency.</p> |
