发明名称 SURFACE TREATMENT METHOD AND ITS DEVICE
摘要 PURPOSE:To remove a mark-peeling-off fault, by performing heat treatment of a desirable part on a main surface by a heating method free from soot. CONSTITUTION:Foreign matters 8 such as mold lubricant remain on the surface of a package 6. Short-time burning, serving as heat-treatment, is performed with a burner 9 or torch for heating one main surface of the package 6, to remove the foreign matters remaining on the marked-plane surface. This burning treatment is made for 0.5-3sec by oxyhydrogen or hydrogen flame of 800 deg.C-1,300 deg.C. Then, marking process is performed with a printing roll 10 to make printing marks 11, and printing ink is solidated in a drying chamber to obtain a package product having marks 11. Because the marks are printed on the clean plane of the package surface, a mark-peeling-off fault never occurs.
申请公布号 JPS6235652(A) 申请公布日期 1987.02.16
申请号 JP19850174135 申请日期 1985.08.09
申请人 HITACHI LTD 发明人 OZOEGAWA SUGURU;FUJIOKA KAZUNAO
分类号 H01L23/00;B29C59/08;B29C71/02;B41F17/36;C08J7/00;H01L21/302;H01L23/544 主分类号 H01L23/00
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