| 摘要 |
Radial cell electroplating device, especially suitable for high current density electrodeposition of metals and metal alloys, wherein the arrangement for feeding the electrolyte to the cell and for discharging it therefrom permits instantaneous regulation of electrolyte flow direction and velocity parameters simply by adjusting valves, so as to adapt those parameters to the movement conditions of the strip to be plated, at the current density used and the prevailing electrolyte aeration conditions, so as to optimize the quality of the product obtained. |
