Bonding flip chips to a substrate.

摘要

The process involves positioning a flip chip above a substrate, while the flip chip has an active surface provided with conductive bumps, so that its active face is oriented toward the substrate. The flip chip is then placed on the substrate so that the bumps align with a bonding pattern on the substrate. The method also entails lowering an ultrasonic horn having a flat surface onto a back side of the flip chip, followed by applying through the ultrasonic horn a force to the back side of the flip chip. The force is normal to the substrate so that minimal lateral displacement of the flip chip and the substrate results.