发明名称 THERMAL INTERCONNECTION SYSTEM
摘要 1. Thermal interconnection system for interconnecting a plurality of printed cards provided with electric components and with a thermal drainage comprising a wall (21) provided with cooling means (called cooling wall hereinafter) on one face of which there is disposed a plurality of parallel walls (18, 19, 20) perpendicular to the cooling wall, between which there are received thermal connectors (26), with the printed cards being fixed thereto, characterized in that said thermal connectors (26) comprise at least one pin (53) perpendicular to the axis of the connector, said pin cooperating respectively with a groove (54) provided in one of the parallel walls (18, 19, 20) parallel to the axis of the connector such that mounting and fixing of the connector is obtained by having the pin slided into the groove.
申请公布号 DE3368844(D1) 申请公布日期 1987.02.05
申请号 DE19833368844 申请日期 1983.03.18
申请人 SOCAPEX 发明人 BRICAUD, HERVE;CASSES, CLAUDE
分类号 H05K7/20;(IPC1-7):H05K7/20;H01R23/70 主分类号 H05K7/20
代理机构 代理人
主权项
地址