| 摘要 |
PURPOSE:To narrow the area of a heat resistant substrate by forming patterned electrodes on the back surface through the side of a ceramic substrate, thereby effectively utilizing on the back surface. CONSTITUTION:Through holes 4 which penetrate from the front surface to the back surface along a line 6 are opened at a ceramic substrate 2 to form electrodes. Then, the substrate 2 is cut along the line 6 arranged with the holes 4. Further, the substrate is cut at the center along the longitudinal direction to form ceramic substrate 10 having heating resistance elements for one thermal head and electrodes. The substrate 10 is disposed on a supporting plate 12; the array of the resistance elements 18 and the electrodes connected with the elements are formed on the front surface, and a driving IC 22 for forming a driving circuit is bonded to the back surface to form a thermal head. |
