| 摘要 |
PURPOSE:To contrive to execute swiftly the formation of the package of a semiconductor device and an inspection of the functions thereof by a method wherein parts consisting of a pellet-mounting substrate, leads, a cap for sealing and a substrate for inspection are formed in advance. CONSTITUTION:On the periphery part of a pellet mounting substrate 1 consisting of a ceramic, leads 2 are fixed one ends thereof; on low-melting point glasses 3, ceramic frame bodies 4 are mounted on the glasses 3. The other end parts of the lead 2 are mounted on the electrodes being formed on the peripheries of the opening part 5 of a substrate 6 for inspection. Moreover, a heat-radiating fin 7 is mounted on the lower surface of the substrate 1. A pellet 8 is mounted on the substrate 1 of the parts formed in advance in such a way, and is electrically connected with the leads 2 using wires 9, and a cap 10 is bonded on the frame bodies 4; hereby the formation of the package is completed. Moreover, as the pellet 8 is also electrically connected, an inspection of the functions thereof can be switly executed. Incidentally, this technique can be effectively applied to the manufacture of a semiconductor device other than a flat package type one as well. |
