| 摘要 |
<p>PURPOSE:To improve a marking property and the identification after marking by forming a marking resin layer on the prescribed portion of a resin-sealed electronic portion. CONSTITUTION:A marking resin layer is formed on the prescribed portion of a resin-sealed electronic component, the portion is marked. The resin of the component may use all synthetic resins such as sole or mixture, or modified resin of phenol resin, epoxy resin, unsaturated polyester resin, and the component may use electric parts such as capacitor, diode, transistor, filter, rectifier, resistor, coil, IC or all electronic parts. Thus, the marking property and the identification function after marking of the component are improved to provide excellent resin-sealed electronic component.</p> |
