| 摘要 |
<p>A chip carrier comprises a rigid, flexible or semi-flexible substrate on which a conductive pattern has been produced by a standard printed circuit method. The preferred method is to coat one or both sides of a copper-coated substrate with a photo-resist, expose, and etch away the unwanted metal. Interconnection holes may be produced using a laser. Flexible substrates are supplied as a continuous tape. Components are soldered to the carrier by reflow soldering or wave soldering. A heat sink, which may be liquid cooled, may be attached to the chip carrier.</p> |
