| 摘要 |
PURPOSE:To reduce the cost with reduced size of the whole device by a method wherein an external I/O terminal is used to electrically connect an electric circuit substrate to a control circuit substrate so as to dispense with a connector for connecting both substrates. CONSTITUTION:A connector for connecting substrates is removed, each external I/O terminal 8 is vertically connected to the specified section which is to be connected to a control circuit substrate 6 for an electric power circuit substrate 2, and the each external I/O terminal 8 is soldered 11 to the wiring pattern on the control circuit substrate 6 by passing through it. With this method, each part to be connected to the control circuit substrate 6 on the electric power circuit substrate 2 electrically connected to the control circuit substrate 6 through the external I/O terminal 8 separately. Therefore, not only the connector for connecting the substrate is dispensed with but also the wiring pattern to the connector mounting section is dispensed with, with the result that the wiring pattern is substantially simplified to reduce the size of the power circuit substrate 2, with the size of the resin outside frame 3' for the mold reduced more than the conventional one. |
