| 摘要 |
PURPOSE:To extremely easily hold and convey materials to be soldered by freely transferrably disposing a self-adhesive tape for conveying the materials to be soldered onto respective units so that the self-adhesive surface formed on the bottom surface of the self-adhesive tape faces the respective units. CONSTITUTION:The self-adhesive tape 45 is transferred along the respective units 12-14 and at the same time, the materials W to be soldered are supplied 23 by each piece to the lower side of the tape 45 from a feeder 22. The top surface of the tape 45 is pressed by a forward and backward operating part 52 of an actuator 51 to adhere the materials W by each piece to the self-adhesive surface 45a on the bottom side of the tape 45. A flux is coated to, for example, lead frames of ICs by a fluxer 12 during the conveyance of the materials W on the respective units 12-14 and after the materials are preheated 13, the materials are soldered by the solder tank 14. The soldered materials W are finally conveyed up to a wedge body 61 so that the materials W are forcibly stripped from the tape 45 by the body 61. The stripped materials are dropped into a recovering vessel 31. |
