发明名称 |
SEMICONDUCTOR PACKAGE WITH HEAT SINK HAVING AIR VENT |
摘要 |
A BGA semiconductor package having an embedded heat sink is proposed. The heat sink mounted on a substrate includes a flat portion and supporting members for supporting the flat portion to be positioned above a semiconductor chip. The flat portion is formed with at least one taper air vent for ventilating air in a gap between the flat portion and the chip during a molding process. This further helps prevent voids from forming in an encapsulant due to the air trapped in a molding resin as being flowing slowly through the gap, and avoid the occurrence of a popcorn effect on the encapsulant during a temperature cycle in subsequent processes. As a result, quality and yield for the packaged products can be significantly improved.
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申请公布号 |
US2002109219(A1) |
申请公布日期 |
2002.08.15 |
申请号 |
US20010909293 |
申请日期 |
2001.07.19 |
申请人 |
YANG CHUNG HSIEN;LAI YU TING |
发明人 |
YANG CHUNG HSIEN;LAI YU TING |
分类号 |
H01L21/56;H01L23/433;(IPC1-7):H01L23/34;H01L23/28;H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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