| 发明名称 |
SHEET FOR REARRANGEMENT, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
| 摘要 |
PROBLEM TO BE SOLVED: To provide structure of a semiconductor device with the flexibility for the design of a semiconductor element is higher than in the conventional case, and to provide a method for easily manufacturing the device at a low cost. SOLUTION: A sheet 26 for rearrangement, which is provided with an insulating sheet 34 and a conductor metal pattern 36 formed on the insulating sheet, is used. |
| 申请公布号 |
JP2002261234(A) |
申请公布日期 |
2002.09.13 |
| 申请号 |
JP20010060348 |
申请日期 |
2001.03.05 |
| 申请人 |
OKI ELECTRIC IND CO LTD |
发明人 |
UCHIDA YASUFUMI;SAEKI YOSHIHIRO |
| 分类号 |
H01L23/12;H01L21/60;H01L23/31;H01L23/495;H01L23/498;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L23/12 |
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